MPE, Inc. (Micro Precision Engineering) is a corporation that was founded in 1993 to provide quick and efficient custom wafer dicing and wafer resizing services. Along with wafer dicing and resizing, we also sell a variety of both new and used dicing saws. Over the years, we have worked with hundreds of satisfied customers all over the world. Our customers have been involved in an array of different industries, including MEMS, Military, Medical, Semiconductor and MicroOptics. This has allowed our team, which has a combined total of 40 years of experience, to work with virtually every type of material in the industry, including Alumina, BGA’s, Calcite, Ferrite, Fused Silica, Glass, Germanium, Gold, Lexan, PZT, Sapphire, SOI, and Silicon wafers. We can accommodate all material sizes up to 300mm/ 12” in diameter and 10mm thick.